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| (R) TAK CHEONG SEM IC O N DU C TO R 500 mW DO-35 Hermetically Sealed Glass - High Voltage Switching Diodes Absolute Maximum Ratings Symbol VRRM TSTG TJ IF (AV) IFSM TA = 25C unless otherwise noted Value 250 -65 to +200 +175 200 1.0 4.0 Units V C C mA A A DEVICE MARKING DIAGRAM AXIAL LEAD DO35 Parameter Maximum Repetitive Reverse Voltage Storage Temperature Range Operating Junction Temperature Average Rectified Forward Current Non-repetitive Peak Forward Current Pulse Width = 1.0 Second Pulse Width = 1.0 second L BA Vx x L : Logo Device Code : TCBAVxx These ratings are limiting values above which the serviceability of the diode may be impaired. Thermal Characteristics Symbol PD RJA Parameter Power Dissipation Thermal Resistance, Junction to Ambient Value 500 300 Units mW C/W Specification Features: DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All external surfaces are corrosion resistant and leads are readily solderable RoHS Compliant Solder hot dip Tin (Sn) lead finish Cathode indicated by polarity band ELECTRICAL SYMBOL Cathode Anode Electrical Characteristics Symbol BV Breakdown Voltage TA = 25C unless otherwise noted Parameter TCBAV19 TCBAV20 TCBAV21 Test Condition IR=100A Limits Min 120 200 250 VR=100V VR=150V VR=200V IF=100mA IF=200mA ----------Max ------100 100 100 1.0 1.25 Unit Volts Volts Volts nA nA nA Volts Volts IR Reverse Leakage Current TCBAV19 TCBAV20 TCBAV21 VF Forward Voltage TRR Reverse Recovery Time IF=IR=30mA RL=100 IRR=3mA --50 nS C Capacitance VR=0V, f=1MHZ --- 5.0 pF October 2006 / B Page 1 TCBAV19/TCBAV20/TCBAV21 (R) TAK CHEONG SEM IC O N DU C TO R Package Outline Package Case Outline DO-35 DO-35 DIM Min Millimeters Max Min Inches Max A B C D 0.46 0.55 0.018 0.022 3.05 5.08 0.120 0.200 25.40 38.10 1.000 1.500 1.53 2.28 0.060 0.090 Notes: 1. 2. All dimensions are within JEDEC standard. DO35 polarity denoted by cathode band. This datasheet presents technical data of Tak Cheong's Switching Diodes. Complete specifications for the individual devices are provided in the form of datasheets. A comprehensive Selector Guide is included to simplify the task of choosing the best set of components required for a specific application. For additional information, please visit our website http://www.takcheong.com. Although information in this datasheet has been carefully checked, no responsibility for the inaccuracies can be assumed by Tak Cheong. Please consult your nearest Tak Cheong's sales office for further assistance. Tak Cheong reserves the right to make changes without further notice to any products herein to further improve reliability, function or design, cost and productivity. TAK CHEONG (R) and are registered trademarks of Tak Cheong Electronics (Holdings) Co., Ltd. October 2006 / B Page 2 |
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